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Murugan, A.
- Development of Empirical Relationships to Predict Strength of P/M Sintered Pure Copper and Pure Nickel Diffusion Bonded Bimetallic Joints
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Authors
Affiliations
1 Dept. of Mechanical Engineering, Pondicherry Engineering College, Puducherry, IN
2 Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, Tamil Nadu, IN
1 Dept. of Mechanical Engineering, Pondicherry Engineering College, Puducherry, IN
2 Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, Tamil Nadu, IN
Source
Manufacturing Technology Today, Vol 14, No 2 (2015), Pagination: 11-19Abstract
In the present study, pure copper (Cu) and pure nickel (Ni) plates prepared by powder metallurgy (P/M) method were bonded by diffusion bonding technique. From the literature, it was identified that the predominant diffusion bonding process parameters such as bonding temperature, holding time and bonding pressure influence the shear and bonding strength of diffusion bonded joints. In this investigation an attempt was made to develop empirical relationships to predict the shear strength and bonding strength of diffusion bonded bimetallic joints of pure Cu/Ni incorporating the above parameters using statistical tools such as design of experiments, analysis of variance and regression analysis. The developed empirical relationships can be used to predict the strength of Cu/Ni bimetallic joints at 95% confidence level.Keywords
Powder Metallurgy, Diffusion Bonding, Design of Experiments, Analysis of Variance and Regression Analysis.
- Enhanced Emission Properties of Carbon Nanoparticles by Hydrothermal Method
Abstract Views :152 |
PDF Views:1
Authors
Affiliations
1 Ultra Precision Engineering Department, Central Manufacturing Technology Institute, Tumkur Road, Bangalore, IN
2 Laboratory of Molecular Imaging, Department of Biomedical Science, CHA University, 605-21 Yoeksam 1-dong, Gangnam-gu, seoul-135-081, KR
3 Central Manufacturing Technology Institute, Tumkur Road, Bangalore, IN
1 Ultra Precision Engineering Department, Central Manufacturing Technology Institute, Tumkur Road, Bangalore, IN
2 Laboratory of Molecular Imaging, Department of Biomedical Science, CHA University, 605-21 Yoeksam 1-dong, Gangnam-gu, seoul-135-081, KR
3 Central Manufacturing Technology Institute, Tumkur Road, Bangalore, IN